Surfx – Automation and Integration
Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity. We proudly supply the most trusted atmospheric plasma machines to industries all over the world. Trust has been built by a relentless pursuit of process tools that are unsurpassed in versatility, speed, selectivity, reliability and cost effectiveness. Surfx promises to deliver a level of automation and integration that is optimally configured for the customer’s needs, whether it be for mass production, high product mix, or research and development.
Key Features
- Gain flexibility and agility
- Eliminate excuses
- Entry level solution
- Eliminate the wait
Technical Specifications
| Speed mm/s | 1,000 mm/s |
| Work area (X/Y/Z) mm | 550/760/60 |
|---|---|
| Footprint (W x D x H) mm | 1000 x 1500 x 1550 |
| Electrical supply | 200-240 VAC, 31 Amp, 50-60 Hz |
| Compressed air | 0.4-0.6 MPa <280LPM clean dry air 60-90 psi <10CFM |
| Primary gas | Argon or Helium |
| Supported plasma heads | Linear Beam: 25, 50, 100mm or Minibeam |
Available Models
Surfx Turnkey Plasma Machine
Our most versatile platform can be configured with drawer, conveyor, or rotary table. Whether you’re cleaning dies, silicon wafers, medical devices or molded plastic parts, the STA-10 can be easily configured for any job. Working volume is 350 x 475 x 100 mm.
Key Industries
- Semiconductor, Solar & Electronics
Brand
Surfx Technologies offers a full range of atmospheric plasma tools for treating microelectro-mechanical systems (MEMS), microfluidics, semiconductors, solar cells, medical devices, sensors, plastics and composites. Our atmospheric plasmas are cleanroom compatible, fast, safe and effective, and will not damage your critical parts. Our Atomflo™ atmospheric plasmas are well suited for surface treatment of many different materials, including polymers, metals, semiconductors, glass and ceramics. Our tools are used for cleaning and activation, etching, surface modification, and deposition.