Essemtec – Dispensing
Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no standard application in dispensing. Specific solutions for each dispensing task depending on both environmental influences and the type of liquid have to be evaluated. Easy programming and operation allow for a wide range of dispensing applications.
Available Models
Technical Specifications
Maximum dispensing speed | Piezo Jet Valve: 150‘000 dots/h |
|---|---|
| Dynamic Shockwave Valve: 80‘000 Dots/h | |
| Time/Pressure Valve: 28‘000 Dots/h | |
| Archimedean Screw Valve: 24‘000 Dots/h | |
| Dispensing mode | Dot, line, curve, interpolated 3D contour |
| Placement XY dots accuracy | 40 μm (3σ) |
| Positioning Z axis accuracy | 20 μm (3σ) |
| PCB dimensions | 50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”) |
| Machine footprint dimensions | 880 x 1090 mm (34.7 x 43”) |
Introducing – The Spider – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Technical Specifications
| Maximum dispensing/jetting speed | Piezo Jet Valve: 145‘000 dots/h |
| Dynamic Shockwave Valve: 720‘000 dots/h | |
| Time/Pressure Valve: 26‘000 dots/h | |
| Archimedean Screw Valve: 22‘000 dots/h | |
| Dispensing mode | Dot, line, curve, interpolated 3D contour |
| Placement XY dots accuracy | ±40 μm (3σ) |
| Positioning Z axis accuracy | ±20 μm (3σ) |
| PCB dimensions | 560 x 610 mm (22 x 24“) |
| Machine footprint dimensions | 1’557 x 1’357 mm (61 x 53“) |
Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Key Features
Essemtec – SpiderCompact Highspeed Jetter and Dispenser 2023
Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150’000 dots per hour, dispenses 3D patterns and much more.
Essemtec – Tarantula
Relentless All Terrain High Speed Dispensing
Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Key Industries
- Semiconductor, Solar & Electronics
Brand
Essemtec leads the industry in adaptive SMT pick-and-place equipment for both high-speed- and micro-dispensing, as well as an intelligent production storage and logistic systems. Our products are equipped with user-friendly software packages, enabling flexible mounting and dispensing design that is unique in the market, as well as extensive and efficient material management. The combination of printed circuit board (PCB) placement accuracy, speed, and high-quality engineering makes our offerings unique. Equipped with the most up-to-date technology, Essemtec products allow easy programming and operation for a wide range of applications.
