Showing 661–675 of 694 results

  • Surfx – Argon Plasma Systems

    The AtomfloTM 600 argon plasma system is ideally suited for in-line cleaning and activation of materials prior to bonding. The plasma produces a beam of reactive atoms that etch away contaminants on the surface all the way down to the...

    The AtomfloTM 600 argon plasma system is ideally suited for in-line cleaning and activation of materials prior to bonding. The plasma produces a beam of reactive atoms that etch away contaminants on the surface all the way down to the atomic scale. The compact and lightweight plasma head, together with the low-voltage, radio-frequency power supply, make it safe and easy to integrate surface treatment into any assembly line. The beam of reactive atoms is low temperature and 100% electrically neutral. It treats metals, glass, and plastics. It will not damage sensitive electronics, or thin film polymers, such as polyethylene. An in-line production system can treat millions of parts per year at a cost of ownership of a few cents per part.

  • Surfx – Automation and Integration

    Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity.  

    Surfx provides turnkey and OEM plasma systems for surface treatment of just about any part, regardless of size, shape, or production quantity.  

  • Systech Illinois – O2 analyzer – OxySense 325i

    This base oxygen analyzer is used in conjunction with a computer interface and will perform most of the functions of the 5250i including non-invasive headspace analysis for packages, bottles and blister packs using the O2xyDot Sensor; package mate...

    This base oxygen analyzer is used in conjunction with a computer interface and will perform most of the functions of the 5250i including non-invasive headspace analysis for packages, bottles and blister packs using the O2xyDot Sensor; package material and design evaluation; closure design and evaluation; MAP production start up monitoring; research and development; QC and assurance, as well as product oxidation studies.

  • Systech Illinois – O2 analyzer – OxySense 5250i

    The OxySense 5250i is the o2 analyzers instrument of choice for laboratories and individuals who need to test or evaluate packaging materials through a variety of studies. These studies include: non-invasive headspace analysis for packages, bottle...

    The OxySense 5250i is the o2 analyzers instrument of choice for laboratories and individuals who need to test or evaluate packaging materials through a variety of studies. These studies include: non-invasive headspace analysis for packages, bottles and blister packs using the O2xyDot Sensor; package material and design evaluation; closure design and evaluation; MAP production start up monitoring; research and development; QC and assurance, as well as product oxidation studies.

  • Systech Illinois – O2 CO2 Tester, the headspace gas analyzer – Gaspace Advance

    This carbon dioxide (CO2) and oxygen (O2) headspace analyzer provides consistently reliable results and simplicity in operation allowing you to maximise your production efficiency. Its large buttons and clear display ensures testing is simple, err...

    This carbon dioxide (CO2) and oxygen (O2) headspace analyzer provides consistently reliable results and simplicity in operation allowing you to maximise your production efficiency. Its large buttons and clear display ensures testing is simple, errors are eliminated and no special operator training is required.

     

    Numerous packs can be tested quickly with just one button press, saving time and making Quality Assurance more efficient. These MAP analyzers can test all pack sizes and very low volumes.

  • Systech Illinois – Package Testers – TME BT Integra-Pack™

    The TME BT Integra-Pack© is a bench-top, highresolution (0.001 psig) test instrument with a small footprint and user-friendly ease of operation. Electronic pressure and flow controls provide precise and repeatable test conditio...

    The TME BT Integra-Pack© is a bench-top, highresolution (0.001 psig) test instrument with a small footprint and user-friendly ease of operation. Electronic pressure and flow controls provide precise and repeatable test conditions, while automatic and high flow output allow testing of large porous packages. Applications cover a range of flexible or rigid, porous and non-porous, open or sealed packages.

  • Systech Illinois – Water Vapor Permeation Analyzer – 7000

    The 7000 water vapor analyzer range utilises the sensitive and stable P2O5 sensor for absolute moisture measurement. These water vapor analyzers offer a wide measurement range of 0.002-1000 g/m²/day and precision temperature, humidity and flow co...

    The 7000 water vapor analyzer range utilises the sensitive and stable P2O5 sensor for absolute moisture measurement. These water vapor analyzers offer a wide measurement range of 0.002-1000 g/m²/day and precision temperature, humidity and flow control. Providing accurate and repeatable results for research and development testing of water transmission rate (wvtr) in both current and newly formulated packaging film materials and fast testing for Quality Control.

  • TME – Package Testers – the smart BT Integra-Pack

    This completely integrated process control tool offers accurate package test results which can be transmitted directly to your quality control department. Its objective is to validate a package ensuring that it matches the high standard of the product enclosed.

  • TMI – Coefficient of Friction/Peel tester – Model 32-76e

    Testing Machines Inc., is globally recognized as the leading supplier of coefficient of friction instrumentation. Our NEW 32-76e coefficient of friction/peel tester uses advanced digital force signaling and high-speed data acquisition software to ...

    Testing Machines Inc., is globally recognized as the leading supplier of coefficient of friction instrumentation. Our NEW 32-76e coefficient of friction/peel tester uses advanced digital force signaling and high-speed data acquisition software to provide unmatched precision and repeatability in COF and peel testing.

    Improved features include a color touchscreen display and intuitive software user interface for easy navigation and test method storage.

    New peel testing capabilities include 180° peel and T-peel measurements.

  • TMI – Compression Tester

    Microprocessor control and operator-friendly software makes the 17-76 simple to operate. A new Servo motor design provides closed loop feedback for accurate and repeatable position control.  Ergonomic control layout maximizes t...

    Microprocessor control and operator-friendly software makes the 17-76 simple to operate. A new Servo motor design provides closed loop feedback for accurate and repeatable position control.  Ergonomic control layout maximizes the testing sequence while minimizing sample testing errors resulting in incorrect data.  The instrument meets or exceeds all international testing standards for accuracy, precision, and parallelism.

  • TMI – Digital Ink Rub Tester – Model 10-20

    The Digital Ink Rub Tester uses the Sutherland-method and is designed to measure scuffing or ink rub resistance. Several tests can be performed including dry rub (the amount of transfer ink from one dry surface to another), wet rub (the amount of ...

    The Digital Ink Rub Tester uses the Sutherland-method and is designed to measure scuffing or ink rub resistance. Several tests can be performed including dry rub (the amount of transfer ink from one dry surface to another), wet rub (the amount of transfer of ink from wetted surface to another), wet bleed or transfer (ink transfer to a water-saturated blotter), wet smear (similar to wet bleed with the addition or rub cycles), functional rub/wet rub (smear or transfer tests using a liquid other than water and hot abrasion).

  • TMI – Elmendorf Tear Tester – Model 83-86

    An automatic, digital tear tester equipped with an optical encoder for measuring the angular position of the pendulum during tearing and converting this measurement to tear strength units. A large, full-color touchscreen display with intuitive, ea...

    An automatic, digital tear tester equipped with an optical encoder for measuring the angular position of the pendulum during tearing and converting this measurement to tear strength units. A large, full-color touchscreen display with intuitive, easy-to-use software provides a revolutionary new approach to testing and data review.

  • TMI – Internal Bond Tester and Prep Station – Model 80-26

    The Internal Bond™ Tester is designed to determine the internal bond strength of a variety of Paper and Board materials according to TAPPI T 569 and ISO 16260. The instrument design is based on a falling pendulum which creates a high speed impac...

    The Internal Bond™ Tester is designed to determine the internal bond strength of a variety of Paper and Board materials according to TAPPI T 569 and ISO 16260. The instrument design is based on a falling pendulum which creates a high speed impact on a paper specimen. The paper specimen is sandwiched between two double-coated tape substrates. The pendulum impact measures the total energy required to delaminate the internal fibers of a specimen in a “Z” type direction into two plies.

  • TSM – Air Reflow

    The TRA series is the outcome of realizing Econology and offers the best performance. Satisfying the economic effectiveness and practicality of your business.

    The TRA series is the outcome of realizing Econology and offers the best performance. Satisfying the economic effectiveness and practicality of your business.

  • TSM – N2 Reflow (TRN III-a)

    The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and...

    The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and reliable results.