TSM – N2 Reflow (TRN III-a)
The TSM N2 Reflow is a high-end reflow oven that provides precise temperature control for the most demanding soldering applications. It features a nitrogen atmosphere that minimizes oxidation and improves soldering quality, ensuring consistent and reliable results. With a compact design and intuitive user interface, the TSM N2 Reflow is a must-have for any electronics manufacturing facility looking to achieve the highest levels of quality and efficiency.
Key Features
- Realize Flux Zero in OVEN -> equip FMS applied with patent technology
- Thermal Interference Innovation in each zone -> Able to set up temperature difference with 60ºC in max. of interzone
- Internal Heat Reduction of Reflow -> apply New Emission System
- Real-time Monitoring,temperature Profile Monitoring and Oxygen Concentration Monitoring in each zone
- Conveyor Vibration Monitoring
Technical Specification
| Monitoring a number of rotations of B/M: | Real-time monitoring spinning numbers of B/M and checking normal operation status of motor spinning in each zone and alarm function applied |
| Oil level detection sensor for C/V chain: | Sensing function of Conveyor Chian Oil Level alerts protection of C/V chain in case of shortage of oil with functions of alarm and message during operation |
| Sensing the level of Flux capacity of FMS Function: | A function that notifies the Flux PM cycle with an alarm after detecting the Flux level in the FMS’s Drain Bottle |
| FMS, Heat Discharging System: | Ventilation cost saving during the process by discharging the Heat outside through the way of sealed duct |
| Large capacity FMS: | Significantly improved cooling and Flux dust performance with twice larger capacity |
Key Industries
- Semiconductor, Solar & Electronics
Brand
TSM has been produced for Reflow Oven and Nitrogen generator with a representative model, Full Auto Soldering Machine since the company’s foundation in 1990.