Malvern Panalytical – XRF – X’Pert³ Materials Research Diffractometers (MRD)

  • MALAYSIA

    DKSH Technology Sdn. Bhd.
    No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
    11900 Bayan Lepas, Penang
    Malaysia

    +604 645 2672

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The new generation of versatile materials research diffraction systems

The long and successful history of PANalytical’s Materials Research Diffractometers (MRD) continues with a new generation – X’Pert³ MRD and X’Pert³ MRD XL.Both systems handle the same wide range of applications with full wafer mapping up to 100 mm (X’Pert³ MRD) or 200 mm (X’Pert³ MRD XL).

DKSH is the exclusive distributor in Cambodia, Laos, Malaysia, Myanmar, Philippines, Thailand and Vietnam.

The improved performance and reliability of the new platform have added more analytical capability and power for X-ray scattering studies in:

  • advanced materials science
  • scientific and industrial thin film technology
  • metrological characterization in semiconductor process development

Technical Specifications

Goniometer- Step SizeMinimum step size 0.0001˚
Goniometer- RadiusRadius: X’Pert³ MRD 320 mm (horizontal); Radius: X’Pert³ MRD XL 420 mm (horizontal)
Open Eulerian Cradle- Chi Rotation+/- 92˚
Open Eulerian Cradle- Phi Rotation2 x 360˚
Open Eulerian Cradle- x,y translation100 x 100 mm (X’Pert³ MRD); 200 x 200 mm (X’Pert³ MRD XL)
Open Eulerian Cradle- z translationminimum step size 1 µm
C-to-C Wafer Loaders- Size2” to 150 mm; 100 to 300 mm

Available Models

Technical Specifications

Goniometer- Step SizeMinimum step size 0.0001˚
Goniometer- RadiusRadius: X’Pert³ MRD 320 mm (horizontal); Radius: X’Pert³ MRD XL 420 mm (horizontal)
Open Eulerian Cradle- Chi Rotation+/- 92˚
Open Eulerian Cradle- Phi Rotation2 x 360˚
Open Eulerian Cradle- x,y translation100 x 100 mm (X’Pert³ MRD); 200 x 200 mm (X’Pert³ MRD XL)
Open Eulerian Cradle- z translationminimum step size 1 µm
C-to-C Wafer Loaders- Size2” to 150 mm; 100 to 300 mm

The standard research and development version for use with thin film samples, wafers (complete mapping up to 100 mm) and solid materials. High-resolution analysis capability is improved by the outstanding accuracy of a new high-resolution goniometer using Heidenhain encoders. 

Technical Specifications

Goniometer- Step SizeMinimum step size 0.0001˚
Goniometer- RadiusRadius: X’Pert³ MRD 320 mm (horizontal); Radius: X’Pert³ MRD XL 420 mm (horizontal)
Open Eulerian Cradle- Chi Rotation+/- 92˚
Open Eulerian Cradle- Phi Rotation2 x 360˚
Open Eulerian Cradle- x,y translation100 x 100 mm (X’Pert³ MRD); 200 x 200 mm (X’Pert³ MRD XL)
Open Eulerian Cradle- z translationminimum step size 1 µm
C-to-C Wafer Loaders- Size2” to 150 mm; 100 to 300 mm

The X’Pert³ MRD XL meets all the high-resolution XRD analysis requirements of the semiconductors, thin films, and advanced materials industries. Complete wafer mapping up to 200 mm is possible. The X’Pert3 version comes with longest liftetime of incident beam components (CRISP) and maximum uptime with pneumatic shutters and beam attenuators. By facilitating analysis of wafers of up to 300 mm in diameter, with a sophisticated, automatic wafer loader option, the X’Pert³ MRD XL becomes an advanced tool for quality control of industrial thin layered structures. 

Technical Specifications

Enclosure- Dimensions1400 (w) x 1162 (d) x 1947 (h) mm
Enclosure- Weight1150 kg
Enclosure- AccessibilityLarge doors, allowing access for up to four people simultaneously
Enclosure- SafetyMeets all relevant worldwide regulations for electrical, mechanical and X-ray safety, with all anode types
Enclosure- Set-upSystem is on wheels for easy installation and relocation
Goniometer- ConfigurationVertical goniometer, available in theta-theta or alpha-1 geometry
Goniometer- Radius and Interface240 mm radius, interfaces are available to reduce the diffracted beam radius for specific applications
Goniometer- Usable RangeMaximum usable range (depending on accessories) -111°< 2θ <168°
Goniometer- Linearity2θ linearity equal or better than ±0.01°
Goniometer- Accuracy and PrecisionNew generation direct optical encoding system (DOPS 2) for lifetime goniometer accuracy, using precisely aligned Heidenhain encoders and path tracking technology
X-Ray Source- X-Ray TubeFully ceramic X-ray tubes manufactured by PANalytical’s specialized factory under cleanroom conditions
X-Ray Source- Generator4 kW generator supporting all current and future X-ray tubes
X-Ray Source- PerformanceAll Empyrean instruments are designed for 60 kV operation, allowing optimal performance for Mo and Ag sources

The X’Pert³ Extended MRD (XL) brings increased versatility to the range of X’Pert³ MRD systems. An extra PreFIX mounting platform allows mounting of an X-ray mirror and a high-resolution monochromator in-line, increasing significantly the intensity of the incident beam. One can benefit from increased application versatility without compromise on data quality, high-resolution X-ray diffraction with high intensities, shorter measurement times for measurements such as reciprocal space mapping and rebuild from standard to extended configuration in minutes thanks to the PreFIX concept. With the 2nd generation PreFIX, reconfiguring is easy and optics positioning is more accurate than ever. 

Technical Specifications

Enclosure- DimI3:J22ensions1400 (w) x 1162 (d) x 1947 (h) mm
Enclosure- Weight1150 kg
Enclosure- AccessibilityLarge doors, allowing access for up to four people simultaneously
Enclosure- SafetyMeets all relevant worldwide regulations for electrical, mechanical and X-ray safety, with all anode types
Enclosure- Set-upSystem is on wheels for easy installation and relocation
Goniometer- ConfigurationVertical goniometer, available in theta-theta or alpha-1 geometry
Goniometer- Radius and Interface240 mm radius, interfaces are available to reduce the diffracted beam radius for specific applications
Goniometer- Usable RangeMaximum usable range (depending on accessories) -111°< 2θ <168°
Goniometer- Linearity2θ linearity equal or better than ±0.01°
Goniometer- Accuracy and PrecisionNew generation direct optical encoding system (DOPS 2) for lifetime goniometer accuracy, using precisely aligned Heidenhain encoders and path tracking technology
X-Ray Source- X-Ray TubeFully ceramic X-ray tubes manufactured by PANalytical’s specialized factory under cleanroom conditions
X-Ray Source- Generator4 kW generator supporting all current and future X-ray tubes
X-Ray Source- PerformanceAll Empyrean instruments are designed for 60 kV operation, allowing optimal performance for Mo and Ag sources

With the X’Pert³ MRD (XL) system for in-plane diffraction, it becomes possible to measure diffraction from lattice planes that are perpendicular to the sample surface.

Standard and in-plane geometries on one system and a wide range of diffraction experiments on polycrystalline and highly perfect thin films, are just two of many benefits.  

Key Features

  • Wafer mapping up to 200 mm meets all the high-resolution XRD analysis requirements.
  • High-resolution analysis capability is improved by the outstanding accuracy of a new high-resolution goniometer using Heidenhain encoders.
  • Provides the longest liftetime of incident beam components (CRISP) and maximum uptime with pneumatic shutters and beam attenuators.
  • With the 2nd generation PreFIX mounting platform, reconfiguring is easy within minutes and optics positioning is more accurate than ever.
  • Allows for the measurement of diffraction from lattice planes that are perpendicular to the sample surface.
  • Possible standard and in-plane geometries on one system and a wide range of diffraction experiments on polycrystalline and highly perfect thin films.

Key Industries

  • Die & Mould
  • Electronics
  • Powders & Pigments / Coating
  • Semiconductor, Solar & Electronics

Brand

Malvern Panalytical

Malvern Panalytical was formed by the merger of Malvern Instruments Limited and PANalytical B.V. on 1st January 2017, has headquarters in both Almelo (the Netherlands), and in Malvern (UK), and employs over 2,000 people worldwide. The combined entity is a strong player and innovator in the materials characterization market and will leverage the strengths of the individual companies in their end markets, ranging from building materials to pharmaceuticals and from metals and mining to nanomaterials.

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