ADT – Dicing Peripheral
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.
Key Features
- Used for dicing wafers and substrates into smaller chips
- High accuracy and low kerf loss for optimal yield
- Compatible with a wide range of materials and thicknesses
- Robust and durable design for long-term use
- Offers advanced automated blade height adjustment and real-time monitoring.
Available Models
Key Industries
- Semiconductor, Solar & Electronics
Brand
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.